Supply, delivery, installation and commissioning of one unit of Flip chip bonder system of Heating plate control box for School of Electrical and Electronic Engineering (EEE), Nanyang Technological University
   

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Supply, delivery, installation and commissioning of one unit of Flip chip bonder system of Heating p...
Nanyang Technological University
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Posted On:  3 May 2024
Open for bidding on:  3 May 2024
Response Deadline:  3 Jun 2024 8:59 AM PDT
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Opportunity Amount: $500.00 USD
Response Deadline: 3 Jun 2024 8:59 AM PDT
(Closed for response)
Posting ID: 19586042(Doc4567695328)
Posting Type: Request for Information
Public Posting: https://discovery.ariba.com/rfx/19586042
Product and Service Categories 
  • Chip placers
Ship-to or Service Locations
Posting Summary
Corrigendum #1
Event closing date has been extended from 14 May 2024 to 3 June 2024, 23:59

 CLARIFICATIONS OF PURCHASE  
               
Please do not post your clarifications through other channels, such as Ariba discovery Q&A or event messages.
               
SUBMISSION REQUIREMENT
               
Please click on “Response to posting” and download the specification document(s) in the sourcing event for more information on contact person and site briefing (if any).
               
All proposals must be submitted through the sourcing event by clicking ‘submit entire response’. Any proposal submitted through other channels, such as Ariba discovery Q&A or event messages, etc. will result in disqualification at the discretion of NTU. Training guide on how to submit your bid is available on NTU website:  https://www.ntu.edu.sg/collaborate-with-us/information-for-suppliers/supplier-user-guide-for-ariba
               
IMPORTANT NOTES
               
1. You cannot change the currency once you have submitted your bid.
               
2. Kindly ignore the opportunity amount as shown above which has been defaulted to USD 500.
               
               

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